Pony Maa
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Dec 20, 1995 → Dec 20, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5684332A | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom | Electricity | 21 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.