Rachita Dewan
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Sep 20, 2007 → Sep 20, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8741737B2 | Three-dimensional wafer stacking with vertical interconnects | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.