Radek P. Chalupa
2Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Feb 6, 2004 → Dec 28, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7279084B2 | Apparatus having plating solution container with current applying anodes | Chemistry; Metallurgy | 4 | Expired |
| US11652067B2 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.