Inventor · Niefern, DE

Rainer Mutz

2Patents
1h-index
5Co-inventors
30Inventor score

Filing activity: Oct 23, 2014 → Dec 7, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US11835075B2 Clip for securing a first element to a second element Mechanical Engineering; Lighting; Heating 1 Active
US9092711B2 Method for producing a smartcard body for receiving a semiconductor chip and smartcard body of this type Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.