Patent · US Active

Method for producing a smartcard body for receiving a semiconductor chip and smartcard body of this type

US9092711B2 · kind B2 · utility

0Cited by

1References

13Claims

0Family size

Assignee

Pretema GmbH · DE

Inventors

Eric Daniel · Sacramento, US
Frank Eberhardt · Niefern, DE
Sébastien Kalck · Niefern, DE
Frédéric Morgenthaler · Wellesley, US
Rainer Mutz · Niefern, DE
Timo Schabinger · Niefern, DE

Key dates

Filing date	Oct 23, 2014
Grant date	Jul 28, 2015
Priority date	—
Expiry date	Oct 23, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.