Ray T. Ko
3Patents
0h-index
1Co-inventors
18Inventor score
Filing activity: Jan 18, 2018 → Jan 22, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10620166B1 | In-plane modulus testing of materials by an ultrasonic same-side method | Physics | 0 | Active |
| US10620167B1 | In-plane modulus testing of materials by an ultrasonic dry-contact method | Physics | 0 | Active |
| US10458958B1 | Ultrasonic through-thickness modulus evaluation of materials | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.