In-plane modulus testing of materials by an ultrasonic same-side method
US10620166B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jan 18, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Sep 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for performing nondestructive evaluation of a specimen comprises a first ultrasonic shear wave transducer configured to be coupled to a first side of a specimen to be tested; a second ultrasonic shear wave transducer configured to be coupled to the first side of the specimen at a predetermined distance from the first ultrasonic shear wave transducer. The first ultrasonic shear wave transducer is configured to transmit a guided wave into the specimen, and the second ultrasonic shear wave transducer is configured to receive the guided wave from the first ultrasonic shear wave transducer. The first ultrasonic shear wave transducer and the second ultrasonic shear wave transducer are low frequency shear transducers that are capable of operating at or below 0.5 MHz (500 kHz). The specimen has a planar surface or a curved surface, and a membrane may be used as the couplant between the specimen and the transducers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.