Richard C. Senger
3Patents
3h-index
10Co-inventors
43Inventor score
Filing activity: Jul 26, 1991 → Aug 19, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5316788A | Applying solder to high density substrates | Electricity | 140 | Expired |
| US5479703A | Method of making a printed circuit board or card | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5811736A | Electronic circuit cards with solder-filled blind vias | Emerging Cross-Sectional Technologies | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.