Method of making a printed circuit board or card
US5479703A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1994 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Sep 21, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of electrically insulating material attached on both sides thereof. The circuitized power cores also include a plurality of plated through holes formed therethrough in substantially the same pattern on each circuitized power core. The circuitized power cores are parallel to each other such that corresponding plated through holes in the two circuitized power cores are co-linear. A plurality of substantially spherical balls are located between the circuitized power cores and are in contact with the corresponding plated through holes on facing cards. The balls have a diameter slightly larger than the opening of the plated through holes and are made of an electrically conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.