Richard Kapp
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Aug 4, 1989 → Aug 4, 1989
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5083193A | Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.