Patent · US Expired

Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility

US5083193A · kind A · utility

2Cited by

4References

7Claims

0Family size

Assignee

Deutsche ITT Industries, GmbH · DE

Inventors

Viktor Heitzler · Umkirch, DE
Richard Kapp · Glottertal, DE

Key dates

Filing date	Aug 4, 1989
Grant date	Jan 21, 1992
Priority date	—
Expiry date	Aug 4, 2009

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

To further reduce the manufacturing costs of semiconductor devices, such as TO-92 transistors or thyristors, a prefabricated plastic can or housing is filled with cast resin, and the chip, together with its leads and a synthetic-resin cover, is inserted into the cast resin and the can, with portions of the leads engaging a groove in the can. The apparatus for inserting the chips, etc., into the cans includes a feed rail for the cans, a centering slide, and a swivelling gripper onto which the cans are pushed by the centering slide. When rotated, the swivelling gripper slips the cans over the chips mounted on a lead frame moving above the swivelling gripper.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.