Richard Stack
10Patents
5h-index
6Co-inventors
51Inventor score
Filing activity: Jun 29, 2001 → Dec 27, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD466866S1 | Communication module | General | 11 | Expired |
| USD466865S1 | Communication module | General | 8 | Expired |
| USD476980S1 | Communication module | General | 7 | Expired |
| USD476978S1 | Communication module | General | 7 | Expired |
| US6613597B2 | Optical chip packaging via through hole | Electricity | 6 | Expired |
| USD476979S1 | Communication module | General | 4 | Expired |
| US8089973B2 | Outdoor hardened exo-modular and multi-phy switch | Electricity | 3 | Active |
| USD477312S1 | Communication module | General | 3 | Expired |
| USD476981S1 | Communication module | General | 3 | Expired |
| US6804438B2 | Method for relaxing mechanical tolerance in an opto-electronic unit | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.