Robert Burman
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Mar 2, 2012 → Mar 2, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8791492B2 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.