Rodney D. Purcell
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Apr 21, 1998 → Apr 21, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6118175A | Wire bonding support structure and method for coupling a semiconductor chip to a leadframe | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.