Wire bonding support structure and method for coupling a semiconductor chip to a leadframe
US6118175A · kind A · utility
3Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1998 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Apr 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible shelf (12) and a method for coupling a semiconductor chip (33) to a leadframe (23) using the flexible shelf (12). The flexible shelf (12) has a mounting portion (16), a flexible portion (17), and a leadframe support portion (18). The flexible shelf (12) is used in a wire bonding support assembly (10) to provide support for the leadframe (23) during wire bonding. The flexible portion (17) of the flexible shelf (12) flexes to increase thermal conductivity between a heater block (29) and the leadframe (23) during wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.