Ronald S. Croff
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Jan 6, 1995 → Jan 6, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5597767A | Separation of wafer into die with wafer-level processing | Emerging Cross-Sectional Technologies | 73 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.