Ryan M. Clement
3Patents
1h-index
3Co-inventors
30Inventor score
Filing activity: Sep 9, 2015 → Dec 21, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9508658B1 | Electromagnetic wall in millimeter-wave cavity | Electricity | 11 | Active |
| US10325850B1 | Ground pattern for solderability and radio-frequency properties in millimeter-wave packages | Electricity | 0 | Active |
| US9741666B1 | Electromagnetic wall in millimeter-wave cavity | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.