Electromagnetic wall in millimeter-wave cavity
US9741666B1 · kind B1 · utility
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2References
20Claims
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Assignee
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Key dates
| Filing date | Oct 25, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Oct 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a package, a wall and a lid. The package may be configured to mount two chips configured to generate one or more signals in a millimeter-wave frequency range. The wall may be formed between the two chips. The wall generally has a plurality of conductive arches that attenuate an electromagnetic coupling between the two chips in the millimeter-wave frequency range. The lid may be configured to enclose the chips to form a cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.