Satish Yeldandi
2Patents
1h-index
3Co-inventors
30Inventor score
Filing activity: Nov 19, 2013 → Jun 15, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9704781B2 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Electricity | 3 | Active |
| US9966347B2 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.