Inventor · Toyonaka, JP

Satoshi Ohnakada

2Patents
2h-index
7Co-inventors
30Inventor score

Filing activity: Jul 29, 1993 → Jun 29, 1995

Most-cited inventions

PatentTitleAreaCited byStatus
US5462626A Method of bonding an external lead and a tool therefor Electricity 6 Expired
US5582341A Bonding apparatus for terminal component Performing Operations; Transporting 2 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.