Bonding apparatus for terminal component
US5582341A · kind A · utility
2Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1995 |
| Grant date | Dec 10, 1996 |
| Priority date | — |
| Expiry date | Jun 29, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/023
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.