Sayaka Hirafune
3Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Aug 24, 2004 → Jul 26, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7180149B2 | Semiconductor package with through-hole | Electricity | 59 | Expired |
| US7274101B2 | Semiconductor package and method for manufacturing the same | Electricity | 21 | Expired |
| US7368321B2 | Semiconductor package and method for manufacturing the same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.