Semiconductor package with through-hole
US7180149B2 · kind B2 · utility
59Cited by
5References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Jan 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.