Sen Wu
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Dec 29, 2017 → Dec 29, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11083091B2 | Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.