Seok Jun Ahn
2Patents
0h-index
6Co-inventors
27Inventor score
Filing activity: Jul 16, 2014 → Apr 15, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9578740B2 | Copper clad laminate, printed circuit board, and method of manufacturing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11076482B2 | Printed circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.