Copper clad laminate, printed circuit board, and method of manufacturing the same
US9578740B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 16, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Aug 13, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.