Setsuo Horimoto
3Patents
3h-index
10Co-inventors
40Inventor score
Filing activity: Apr 7, 1992 → Aug 2, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5813115A | Method of mounting a semiconductor chip on a wiring substrate | Emerging Cross-Sectional Technologies | 81 | Expired |
| US5255429A | Component mounting apparatus | Emerging Cross-Sectional Technologies | 72 | Expired |
| US5564183A | Producing system of printed circuit board and method therefor | Emerging Cross-Sectional Technologies | 39 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.