Producing system of printed circuit board and method therefor
US5564183A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1993 |
| Grant date | Oct 15, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.