Seung Hee JO
2Patents
1h-index
3Co-inventors
27Inventor score
Filing activity: Apr 28, 2011 → Nov 1, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8592952B2 | Semiconductor chip and semiconductor package with stack chip structure | Electricity | 6 | Active |
| US8609535B2 | Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.