Seung Wan Shin
4Patents
2h-index
9Co-inventors
33Inventor score
Filing activity: Aug 10, 2010 → Feb 26, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10347585B2 | Fan-out semiconductor package | Electricity | 40 | Active |
| US9196506B2 | Method for manufacturing interposer | Electricity | 2 | Active |
| US10685916B2 | Fan-out semiconductor package | Electricity | 2 | Active |
| US8582314B2 | Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.