Method for manufacturing interposer
US9196506B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2012 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | May 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.