Seung-Weon Ha
4Patents
2h-index
11Co-inventors
37Inventor score
Filing activity: Sep 20, 2011 → Nov 16, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8245902B2 | Wire bonding apparatus and method using the same | Electricity | 4 | Active |
| US9500599B2 | Surface inspection apparatus for semiconductor chips | Physics | 4 | Active |
| US10147706B2 | Multi-chip package and method of manufacturing the same | Electricity | 2 | Active |
| US10679972B2 | Method of manufacturing multi-chip package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.