Wire bonding apparatus and method using the same
US8245902B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2011 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Sep 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a wire bonding apparatus and a method wire bonding and manufacturing a semiconductor device using the same. The wire bonding apparatus includes a heater block configured to support a stack including a chip mounting frame and a plurality of chips stacked on the chip mounting frame. The heater block is configured to supply heat to a first portion of the stack. The apparatus further includes a chip heating unit disposed at a different height from the heater block. The chip heating unit is configured to supply heat to a second portion of the stack at a different height from the first portion. The apparatus further includes a first temperature sensing unit positioned to be located at a first height and to determine a first temperature at the first portion of the stack, a second temperature sensing unit positioned to be located at a second height and to determine a second temperature at the second portion of the stack, and a temperature adjusting unit configured to compare the first temperature to the second temperature and to adjust the magnitude of the heat supplied by at least one of the heater block and the chip heating unit according to a result of the comparison.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.