Sheng Chao
6Patents
1h-index
5Co-inventors
36Inventor score
Filing activity: Sep 30, 2011 → Dec 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8647737B2 | Method for fabrication of crack-free ceramic dielectric films | Emerging Cross-Sectional Technologies | 2 | Active |
| US9355761B2 | Method for fabrication of crack-free ceramic dielectric films | Emerging Cross-Sectional Technologies | 1 | Active |
| US10730801B2 | Sintered ceramic bodies and applications thereof | Chemistry; Metallurgy | 0 | Active |
| US9834843B2 | Method for fabrication of crack-free ceramic dielectric films | Emerging Cross-Sectional Technologies | 0 | Active |
| US10173930B2 | Sintered ceramic bodies and applications thereof | Chemistry; Metallurgy | 0 | Active |
| US9845268B2 | Sintered ceramic bodies and applications thereof | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.