Shigui Xin
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: Aug 25, 2021 → Aug 25, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12002734B2 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.