SHIH-CHING LIN
2Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Dec 6, 2018 → May 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11839024B2 | Composite and copper clad laminate made therefrom | Electricity | 0 | Active |
| US11466379B2 | Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.