Composite and copper clad laminate made therefrom
US11839024B2 · kind B2 · utility
0Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | May 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are composites comprising copper foils having at least one smooth surface and an adhesive layer with low Dk and Df properties. Also disclosed are copper clad laminates made by laminating the present composites with flexible or rigid substrates that exhibit heat resistance and good to excellent bonding strength. The PCBs made therefrom exhibit low insertion loss and may be assembled with other components to form various electrical devices utilizing high speed of at least 1 Gps or high frequency signals of at least 1 GHz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.