Shinichiro Arikawa
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Mar 5, 1991 → Mar 5, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5298459A | Method of manufacturing semiconductor device terminal having a gold bump electrode | Emerging Cross-Sectional Technologies | 30 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.