Shunsaku Node
5Patents
3h-index
25Co-inventors
49Inventor score
Filing activity: Feb 23, 1998 → Oct 21, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6042922A | Adhesive sheet for wafer setting and process for producing electronic component | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6440584B1 | Hot-dip galvanized steel sheet and method for producing the same | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6284364A | Silicate-containing sheet | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6699592B2 | Galvannealed steel sheet and method for manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6544641B2 | Silicate-containing sheet | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.