Adhesive sheet for wafer setting and process for producing electronic component
US6042922A · kind A · utility
21Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1998 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Feb 23, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive sheet for wafer setting, comprising a wafer setting part composed of an expansible film and an adhesive layer for wafer setting and a marginal part outside the wafer setting part, PA1 wherein the marginal part has an antiexpansibility greater than that of the wafer setting part. This enables secure expansion in a process for producing an electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.