Simon Karecki
6Patents
5h-index
21Co-inventors
55Inventor score
Filing activity: Jan 17, 2002 → May 5, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7361991B2 | Closed air gap interconnect structure | Electricity | 48 | Expired |
| US7309649B2 | Method of forming closed air gap interconnects and structures formed thereby | Electricity | 23 | Active |
| US7393776B2 | Method of forming closed air gap interconnects and structures formed thereby | Electricity | 18 | Active |
| US6734096B2 | Fine-pitch device lithography using a sacrificial hardmask | Electricity | 10 | Expired |
| US6732908B2 | High density raised stud microjoining system and methods of fabricating the same | Electricity | 8 | Expired |
| US7546670B2 | Method for producing thermally matched probe assembly | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.