High density raised stud microjoining system and methods of fabricating the same
US6732908B2 · kind B2 · utility
8Cited by
25References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2002 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | Jul 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microjoint interconnect structure comprising a dense array of metallic studs of precisely controllable height tipped with a joining metallurgy. The array is produced on a device chip that is to be attached to a carrier, or to a carrier along with other devices, some of which may be selected to have similar interconnect structures so as to form all together an assembled carrier that functions as a complete computing, communications or networking system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.