Simon Reiss
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Nov 14, 2019 → Nov 14, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11373936B2 | Flat no-leads package, packaged electronic component, printed circuit board and measurement device | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.