Simone Frasca
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Apr 29, 2021 → Apr 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11735478B2 | System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.