Stan Mihelcic
4Patents
4h-index
11Co-inventors
40Inventor score
Filing activity: Jun 18, 2003 → Apr 24, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7463062B2 | Structured integrated circuit device | Electricity | 257 | Active |
| US7098528B2 | Embedded redistribution interposer for footprint compatible chip package conversion | Electricity | 11 | Expired |
| US7117467B2 | Methods for optimizing package and silicon co-design of integrated circuit | Physics | 8 | Expired |
| US6963129B1 | Multi-chip package having a contiguous heat spreader assembly | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.