Stefan Hampl
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Jan 25, 2022 → Jan 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12068296B2 | Method for wafer bonding and compound semiconductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.