Stefan Lutter
6Patents
3h-index
7Co-inventors
46Inventor score
Filing activity: Jun 21, 2002 → Mar 8, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6780767B2 | Semiconductor component in a wafer assembly | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6979407B2 | Process for producing an SPM sensor | Physics | 3 | Expired |
| US6958124B2 | SPM sensor and process for producing it | Physics | 3 | Expired |
| US9064686B2 | Method and apparatus for temporary bonding of ultra thin wafers | Emerging Cross-Sectional Technologies | 1 | Active |
| US6953751B2 | Micro device and process for producing it | Physics | 0 | Expired |
| US8353255B2 | Device for coating a substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.