Stephen A. Smiley
3Patents
3h-index
5Co-inventors
43Inventor score
Filing activity: Jul 15, 1985 → Aug 28, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4611238A | Integrated circuit package incorporating low-stress omnidirectional heat sink | Electricity | 86 | Expired |
| US5579205A | Electromechanical module with post-solder attachable/removable heat sink frame and low profile | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5424580A | Electro-mechanical assembly of high power and low power IC packages with a shared heat sink | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.