Integrated circuit package incorporating low-stress omnidirectional heat sink
US4611238A · kind A · utility
86Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1985 |
| Grant date | Sep 9, 1986 |
| Priority date | — |
| Expiry date | Jul 15, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48472
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is convex for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.