Steven L. Post
2Patents
2h-index
1Co-inventors
27Inventor score
Filing activity: Mar 13, 1987 → Aug 5, 1988
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4890156A | Multichip IC module having coplanar dice and substrate | Electricity | 6 | Expired |
| US4792533A | Coplanar die to substrate bond method | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.